Wirenet.org Header Logo
Home
Login
My Information
My Membership
Chapter Directory
Committee Directory
Request Information
Upcoming Events
WAI Store
New Membership | Subscriptions | Packages | Books | Tech Papers | Media | Other Products | Events | Donations

Development of an apparatus for determining the free tin thickness on tin-plated copper wire

$ 0.00 - Tech. Paper #P05387 (Member Price)
$ 15.00 - Tech. Paper #P05387 (List Price)
We're sorry, but there is no inventory for the product you selected. Check out these other great products:

Related Items

15.00
Description

By Sevim Özaltun and Serdar Karadeniz, Er-Bakir, Turkey
2009
 
The presence of sufficient free tin on the wire surface is essential in terms of solderability and crimpability properties. Therefore, reliable measurement of free tin on finished products such as multiwire or stranded conductors is extremely important to meet both customer’s requirements and for controlling production costs. This paper describes the steps of development for a measurement device and related verification studies.  
 
Downloadable PDFThis product is only available as a downloadable pdf document.