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Bond strength of PC wire in concrete

$ 0.00 - Tech. Paper #P05154 (Member Price)
$ 15.00 - Tech. Paper #P05154 (List Price)
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By Toshio Maehata and Hiroichi Toka, Shinko Wire Co., Ltd., Japan
2005
 
This paper examines the amount of dry soap used during wiredrawing and heat treatment like bluing or hot-stretching during the final process. The authors confirmed that the less the amount of residual dry soap, the higher the bond strength. Heat treatment showed the higher the temperature, the higher the bond strength without the relation of the amount of residual lubricant. That means the oxidization film formed on the wire surface by high temperature mainly determined the bond strength.
  
 
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