Wirenet.org Header Logo
Home
Login
My Information
My Membership
Chapter Directory
Committee Directory
Request Information
Upcoming Events
WAI Store
New Membership | Subscriptions | Packages | Books | Tech Papers | Media | Other Products | Events | Donations

Effect of die semi-angle and multi-pass drawing on additional shear strain layer

$ 0.00 - Tech. Paper #P05289 (Member Price)
$ 15.00 - Tech. Paper #P05289 (List Price)
We're sorry, but there is no inventory for the product you selected. Check out these other great products:

Related Items

15.00
Description

By Kazuki Hosoda, Motoo Asakawa, Satoshi Kajino, and Y. Maeda, Waseda University, Japan
2007
 
The hardened layer at the surface of fine-drawn wire, the additional shear strain layer, is around 0.04 mm in depth and is generated by the friction between dies and wire. The main purpose of this paper is to clarify the tensile strength and microstructure of the additional shear strain layer. It was found that the layer is hardened in drawing with a low semi-angle die. It was also found that there is a correlation between an increase in tensile strength and the subdivisions of crystal grains in the additional shear strain layer.
  
 
Downloadable PDFThis product is only available as a downloadable pdf document.