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2001, 57 pages

This report comprises four technical papers that were presented in a theme session during the Wire & Cable Technical Symposium at WAI's 71st Annual Convention, Atlanta, May 2001.

The following papers are included:

  • "Effects of compound ingredients on rubber adhesion to steel cord," by Yasuhiro Ishikawa and Takeshi Hataka, Yokohama Rubber Co., Japan.
  • "Promoters for enhanced adhesion of steel cord to rubber," by Yea-Yang Su, Amercord, Inc., and Robert M. Shemenski, RMS Consulting, Inc., USA.
  • "Adhesion technology for nickel plating and natural rubber compound," by Shunji Hachisuka and Jun Nakayama, Tokyo Rope Manufacturing Co., Ltd., Japan.
  • "Plasma polymerized primers for rubber-to-steel bonding," by C.M. Bertelsen and F.J. Boerio, University of Cincinnati, and D.K. Kim, The Goodyear Tire & Rubber Co., USA.