Wirenet.org Header Logo
Home
Login
My Information
My Membership
Chapter Directory
Committee Directory
Request Information
Upcoming Events
WAI Store

ABOUT TRUST ONLINE
New Membership | Subscriptions | Packages | Books | Tech Papers | Media | Other Products | Events | Donations

Development of a numerical model for predicting the temperature of a steel wire threaded through a fluidized bed for patenting treatment

$ 0.00 - Tech. Paper #P04764 (Member Price)
$ 15.00 - Tech. Paper #P04764 (List Price)
We're sorry, but there is no inventory for the product you selected. Check out these other great products:

Related Items

15.00
Description

By Takanari Hamada, Yutaka Neishi, Shoji Nishimura and Masanori Sakamoto, Sumitomo Metal Industries, Ltd., Japan
2000
 
A numerical model was developed to simulate the temperature history of a wire threaded through a fluidized bed for the patenting treatment. The model is a simple one-dimensional finite difference model of heat conduction and transfer in the radial direction, but it precisely simulates the history of wire temperature throughout the fluidized bed.
  
 
Downloadable PDFThis product is only available as a downloadable pdf document.