Wirenet Image Band
wirenet.org mobile image band
Online Store Contact Us

Online Store

Chevron crack and optimum drawing condition in the diagram of mean stress and die-wire contact length ratio by FEM simulation

Chevron crack and optimum drawing condition in the diagram of mean stress and die-wire contact length ratio by FEM simulation

Available
Rating: 0 out of 5
  • 1
  • 2
  • 3
  • 4
  • 5
No Reviews
Quick Overview:
The internal stress and temperature distributions during wiredrawing and residual stress after the cooling of drawing temperature were simulated with FEM. The mean stress (hydrostatic stress) on the ...
Price:

$15.00 - Tech. Paper #P04712 (List Price)

$0.00 - Tech. Paper #P04712 (Member Price)

Number of pages:5
Year published:2000
Weight:0.2500
Share it:
Add to Cart
15.00
Required
Description
By Akikazu Nakagiri, Takaaki Yamano and Masazumi Konaka, Kansai University; Kazunari Yoshida, Tokai University; and Motoo Asakawa, Waseda University, Japan
2000
 
The internal stress and temperature distributions during wiredrawing and residual stress after the cooling of drawing temperature were simulated with FEM. The mean stress (hydrostatic stress) on the central axis of wire was found in various kinds of die semi-angle and reduction. The diagram of the mean stress on the die-wire contact length ratio to the diameter was found. The chevron crack existence condition was shown from the diagram to the die-wire contact length ratio when the tensile mean stress was the maximum value of the stress at 0.1 of the die-wire contact length ratio.
  
 
Downloadable PDFThis product is only available as a downloadable pdf document.
We're sorry, but there is no inventory for the product you selected. Check out these other great products:

Related Products

    Other Purchased Products

      Reviews

      No records found.