Wirenet Image Band
wirenet.org mobile image band
Online Store Contact Us

Online Store

Development of an apparatus for determining the free tin thickness on tin-plated copper wire

Development of an apparatus for determining the free tin thickness on tin-plated copper wire

Available
Rating: 0 out of 5
  • 1
  • 2
  • 3
  • 4
  • 5
No Reviews
Quick Overview:
The presence of sufficient free tin on the wire surface is essential in terms of solderability and crimpability properties. Therefore, reliable measurement of free tin on finished products such as mu ...
Price:

$15.00 - Tech. Paper #P05387 (List Price)

$0.00 - Tech. Paper #P05387 (Member Price)

Number of pages:5
Year published:2009
Weight:0.2500
Share it:
Add to Cart
15.00
Required
Description
By Sevim Özaltun and Serdar Karadeniz, Er-Bakir, Turkey
2009
 
The presence of sufficient free tin on the wire surface is essential in terms of solderability and crimpability properties. Therefore, reliable measurement of free tin on finished products such as multiwire or stranded conductors is extremely important to meet both customer’s requirements and for controlling production costs. This paper describes the steps of development for a measurement device and related verification studies.  
 
Downloadable PDFThis product is only available as a downloadable pdf document.
We're sorry, but there is no inventory for the product you selected. Check out these other great products:

Related Products

    Other Purchased Products

      Reviews

      No records found.