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Effect of the Sn content of bead wire and the kind of compound on the interface morphology

Effect of the Sn content of bead wire and the kind of compound on the interface morphology

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This paper presents the effect on the structure of adhesion interface and adhesion strength of the Sn content of bead wire and of compound types. The clean adhesion interlayer was successfully obtain ...
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$15.00 - Tech. Paper #P05357 (List Price)

$0.00 - Tech. Paper #P05357 (Member Price)

Number of pages:4
Year published:2009
Weight:0.2500
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By Song Seong-Hun and Ban Deok-Young, Kiswire R&D Center, and Cho Kil-Won, Pohang University of Science and Technology (POSTECH), South Korea
2009
 
This paper presents the effect on the structure of adhesion interface and adhesion strength of the Sn content of bead wire and of compound types. The clean adhesion interlayer was successfully obtained by non-contact method, i.e. inserting a small gap between wire and rubber during vulcanization. Adhesion interface was analyzed by SEM, XPS, and XRD of Synchrotron (Pohang light source).  
 
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