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Occurrence of dynamic recrystallization in copper wiredrawing

Occurrence of dynamic recrystallization in copper wiredrawing

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Without annealing, copper wire can be drawn until the total cross-sectional reduction ratio goes up to 99% or more. This study examines the influence of dynamic recrystallization on drawability and m ...
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$15.00 - Tech. Paper #P05414 (List Price)

$0.00 - Tech. Paper #P05414 (Member Price)

Number of pages:5
Year published:2010
Weight:0.2500
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By Kazunari Yoshida, Yasutoshi Takemoto, and Naoyuki Katsuoka, Tokai University, Japan
2010
 
Without annealing, copper wire can be drawn until the total cross-sectional reduction ratio goes up to 99% or more. This study examines the influence of dynamic recrystallization on drawability and mechanical characteristics of drawn copper wire.
  
 
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